Selective Laser Etching and Direct Laser Writing
The LightFab 3D Printer M is an industrial-grade 3D-printer workstation for selective laser etching (SLE) and direct laser writing (DLW). It is equipped with a 1030 nm femtosecond/picosecond laser with modulator (M² ~ 1.2), pulse duration tunable from ~400 fs to ~5 ps via software, repetition rate 100 kHz–10 MHz, and ≥8 W average power at 0.5 MHz (max pulse energy ~16 µJ at 0.5 MHz for writing up to 10 mm in glass). Process materials: SLE in glass (fused silica, Borofloat where possible) and sapphire; DLW/ablation in graphite, ceramics, metal, plastic, and optical fiber facets. Sample size: designs up to 160×160 mm; workpieces up to 10 mm thickness. Surface roughness with SLE is below 1 µm, with on-the-fly z-focus correction across the galvo range.
The positioning system is a 3-axis stage: travel 200×200×150 mm³, XY repeatability ±100 nm, XY resolution 3 nm, max XY speed 400 mm/s, Z repeatability ±0.5 µm, Z precision ±1 µm over 50 mm, Z resolution 50 nm, max Z speed 10 mm/s; continuous wafer-level patterning and curved XYZ writing in continuous motion. Scanning: galvo at 1030 nm; write speed 200 mm/s, positioning ~700 mm/s (~3 ms); glass welding ≥15 mm/s. Vision and metrology: real-time camera with feature recognition, autofocus using the writing laser, integrated microscope and camera for in-situ process viewing.
Sample handling: manual with automatic alignment, tilt control, and software compensation for rotation via marker positions. Sample holder: vacuum-suction for flat workpieces plus holder for optical fibers. Fume extraction is included. Software: single GUI (Rhino 3D); automated slicing and hatching with user control over paths and nodes; spline-based curved hatch and contours; import STP, IGES, STL, DXF, DWG, AMF, PLT, FAB, SVG; parameter studies via .csv. Construction: granite base with passive vibration isolation on optical table; fully interlocked, CE-compliant housing (Class 1 laser system). Motorized optical attenuator and motorized half-waveplate for polarization.
Applications: microfluidics, integrated optics, MEMS, glass welding, fiber facet processing, 2PP of polymers (best in controlled lighting), rapid prototyping of 3D glass and multi-material parts.
Features
Laser
- 1030 nm ultrashort pulse NIR, Class 4; M² ~ 1.2
- Pulse duration: ~400 fs–5 ps (software-tunable); motor-controlled fs/ps
- Repetition rate: 100 kHz–10 MHz; ≥8 W at 0.5 MHz; max pulse energy ~16 µJ at 0.5 MHz (10 mm writing in glass)
- Automated power measurement; motorized/software power attenuation; motorized OD filter
Processes & materials
- SLE: fused silica, Borofloat, sapphire; surface roughness ~1 µm (on-the-fly z focus correction)
- DLW/ablation: graphite, ceramics, metal, plastic, optical fiber facets
Positioning (Aerotech 3-axis)
- Travel: 200×200×150 mm³; continuous wafer-level and curved XYZ writing
- XY: repeatability ±100 nm, resolution 3 nm, max speed 400 mm/s
- Z: repeatability ±0.5 µm, precision ±1 µm over 50 mm, resolution 50 nm, max speed 10 mm/s
Scanning
- Galvo at 1030 nm; write speed 200 mm/s; positioning ~700 mm/s (~3 ms); welding ≥15 mm/s
Optics & vision
- 3D microscanner; 20× and 10× objectives; real-time camera with feature recognition; autofocus with writing laser; integrated microscope/camera for in-situ metrology
Sample
- Up to 160×160 mm design, 10 mm thickness; vacuum sample holder; manual load with auto alignment, tilt and rotation compensation via markers
Software & control
- Single GUI; Rhino 3D; slicing/hatching with user path/node control; curved (spline) hatch and contours; import STP, IGES, STL, DXF, DWG, AMF, PLT, FAB, SVG;csv-driven parameter studies
System
- Suction and filter (fume extraction); glass welding module; laser-safe sliding-door casing; manual polarization adjustment module; Thorlabs power meter; passive vibration isolation; CE, Class 1 laser housing
