Sputter Deposition System
The Kurt J. Lesker PRO Line PVD 75 is a box-style sputter deposition system for magnetron sputtering (and optional thermal/e-beam evaporation). The OIST system is configured with four 2-inch targets and supports materials including Al, Ti, Cr, ITO, Si3N4, SiO2, and Nb (more targets on demand). The chamber is 304L stainless steel coupled with a load lock for quick pumping. Substrate capacity is up to 6" (150 mm) diameter with substrate heating to 350°C and rotation up to 20 RPM. Base pressure 8×10⁻⁸ torr). DC and RF power allow deposition of conductive and insulating layers; reactive sputtering is supported for oxides and nitrides. Applications include metallization, transparent electrodes, optical and passivation coatings, and multi-layer thin-film R&D.
Features
- Four 2-inch magnetron sputter targets (materials: Al, Ti, Cr, ITO, Si3N4, SiO2, Nb, more targets on demand)
- Sample holder: from small pieces to max substrate 6" (150 mm) diameter, homogeneity ±5% up to 4-inch.
- Base pressure: typically 8×10⁻⁸ torr
- Substrate heating: up to 350°C; rotation up to 20 RPM
- RF substrate bias available for oxide/nitride depositions and sample cleaning
- DC / RF power supply options for metals and dielectrics
- Applications: metallization, ITO, optical and passivation layers, reactive sputtering
