SCVS Oxidation Furnace

Compact R&D oxidation furnace for diffusion up to 1300 °C. Wet/dry oxide with modular controls and low power use.

wafer processing oxidation furnace for the nanofab

The SVCS Oxidation Furnace is a standalone system designed for advanced thermal processing in R&D and pilot fabs. Capable of diffusion applications, it supports a wide range of semiconductor and materials processes including wet/dry oxidation.

The system offers high precision with one temperature zone and uniformity within ±0.5 °C across a 12 flat zone, reaching process temperatures up to 1300 °C. Its modular control architecture and small footprint make it ideal for flexible lab environments.

Equipped with 4 gas lines (Support up to 8 gas lines and two liquid sources).

Designed for reliability and ease of use, it provides a safe, energy-efficient platform for oxidation, doping, and annealing processes.

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Features

Key Features

  • Ideal for R&D labs and pilot fabs
  • Compact footprint – standalone configuration
  • Low power consumption and easy maintenance
  • Heating element: 1 temperature zone (upgradeable to 3 zones)
  • Max temperature: up to 1300 °C
  • Flat zone uniformity: ±0.5 °C
  • Modular control system with independent hardware interlocks
  • 4 gas lines

Atmospheric Processes

  • Diffusion and drive-in at high temperature.
  • Doping from solid sources is possible with a system upgrade.
  • Suitable for annealing, curing, and sintering.
  • Supports Pyrogenic Wet Oxide with External Burning System, Wet Oxide with ultrapure steamer, and Dry Oxide (High Pressure Oxide).

Technical Data

Parameter Specification
Sample size 2″–4″ (50–100 mm) and pieces
Wafer load Up to 5 wafers per batch
Heating zones 1 (upgradeable to 3)
Flat zone Up to 200 mm
Temperature range 200 °C – 1300 °C
Uniformity ±0.5 °C across flat zone