Plasma-Enhanced Chemical Vapor Deposition (PECVD)

The Samco PD-200NL is a Plasma-Enhanced Chemical Vapor Deposition (PECVD) system optimized for high-quality films deposition of silicon dioxide (SiO), silicon nitride (SiN) and amorphous silicon.

cleanroom tech with wafer sample positioner and touchscreen PC controls

The system uses a capacitive coupling plate (CCP) with RF power to generate a controlled plasma environment, ensuring precise deposition. It offers excellent film uniformity, stress control, and process stability, making it ideal for a wide range of applications in microelectronics and photonics.

Reservations & Training

Inventory ID:

ENG-N057

Manufacturer:

Samco

Model:

PD-200NL

Year Installed:

2025

Categories

Deposition Nanofab sample preparation

Section

Room Number:

L5-D46

Open to External Use?:

Yes

Operation:

User/Staff Operated

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Features

RF power source: up to 300W at 13.56 MHz with Automatic matching
Temperature Range: up to 400°C
Process pressure: 1 to 100mTorr
Process Gases: Ar, N₂, SiH₄, N₂O, NH₃, CF₄
Deposition rate >100nm/min
Max thickness per run: 4µm
Sample size: from 5x5mm to 4-inch wafer
Load lock for sample introduction

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