Maskless Aligner & Maskless direct-write lithography system
Features
- Writing area: 149×149 mm max; wafer size 155×155×7 mm max
- Minimum feature sizes: 0.6 µm, 1 µm, 5 µm (software-selectable, no manual lens change)
- Light source: 365 nm long-life semiconductor
- XY interferometer: 15 nm resolution; 30 nm minimum addressable grid; 15 nm stage resolution
- Write speed: up to 15 mm²/min (0.6 µm), 50 mm²/min (1 µm), 180 mm²/min (5 µm)
- Autofocus: yellow light with real-time surface-tracking laser; no minimum wafer size
- Microscope: ×3, ×10, ×20 objectives
- Alignment: to lithographic markers, ±1 µm (3σ)
- Grey-scale: 255 levels for 3D patterning
- File formats: CIF, GDS2, BMP, TIFF, JPEG, PNG, GIF; Oasis, DXF
- Wafer centring: automatic laser-based; wafer inspection (per-die imaging); 2D optical surface profiler (200 nm thickness resolution); autocalibration; software API; 2D barcode generation