Maskless Aligner & Maskless direct-write lithography system

365 nm source with real-time surface-tracking laser, grey-scale exposure, optical profiler and wafer inspection. For MEMS, microfluidics, and photoresist patterning without physical masks.

table-top maskless lithography tool

The Durham Magneto Optics MicroWriter ML3 Mesa is a maskless (direct-write) photolithography system with a 365 nm long-life semiconductor light source. Maximum writing area is 149×149 mm; maximum wafer size 155×155×7 mm. Minimum feature sizes are 0.6 µm, 1 µm, and 5 µm across the full writing area, with automatic selection of resolution via software (no manual lens change).

The XY interferometer has 15 nm resolution for precise motion control; write speeds are up to 15 mm²/min (0.6 µm), 50 mm²/min (1 µm), and 180 mm²/min (5 µm). An autofocus system using yellow light with real-time surface-tracking laser has no minimum wafer size. The system includes a high-quality optical microscope with ×3, ×10, and ×20 objectives, alignment to lithographic markers (±1 µm 3σ), grey-scale exposure (255 levels) for 3D patterning, and a 30 nm minimum addressable grid (15 nm stage resolution).

File formats: CIF, GDS2, BMP, TIFF, JPEG, PNG, GIF; Oasis, DXF. Additional capabilities: automatic laser-based wafer centring, built-in 2D optical surface profiler (200 nm thickness resolution), automatic wafer inspection (each die imageable), autocalibration tool, and software API for external control. 2D barcodes can be generated for exposures.

Applications: MEMS, microfluidics, spintronics, 2D materials, micro-optics, rapid prototyping without masks.

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Features

- Writing area: 149×149 mm max; wafer size 155×155×7 mm max
- Minimum feature sizes: 0.6 µm, 1 µm, 5 µm (software-selectable, no manual lens change)
- Light source: 365 nm long-life semiconductor
- XY interferometer: 15 nm resolution; 30 nm minimum addressable grid; 15 nm stage resolution
- Write speed: up to 15 mm²/min (0.6 µm), 50 mm²/min (1 µm), 180 mm²/min (5 µm)
- Autofocus: yellow light with real-time surface-tracking laser; no minimum wafer size
- Microscope: ×3, ×10, ×20 objectives
- Alignment: to lithographic markers, ±1 µm (3σ)
- Grey-scale: 255 levels for 3D patterning
- File formats: CIF, GDS2, BMP, TIFF, JPEG, PNG, GIF; Oasis, DXF
- Wafer centring: automatic laser-based; wafer inspection (per-die imaging); 2D optical surface profiler (200 nm thickness resolution); autocalibration; software API; 2D barcode generation