HF vapor etcher

The Primaxx HF Vapor etching system is a tool designed for the precise and selective removal of sacrificial silicon dioxide (SiO₂) layers in MEMS.

cleanroom system for controlled etching with control panel on front side. Fully contained.

The system uses a dry, plasma-free process, employing anhydrous hydrogen fluoride (HF) vapor combined with ethanol to achieve isotropic etching, effectively releasing microstructures without the stiction and damage associated with traditional wet etching methods.

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Features

Etch Rate: Typically ranges from 0.1 to 10 µm/min Operating Pressure: Between 75 and 150 Torr. Operating Temperature: Approximately 45°C. Sample size: small piece to 100 mm.