The Primaxx HF Vapor etching system is a tool designed for the precise and selective removal of sacrificial silicon dioxide (SiO₂) layers in MEMS.
The system uses a dry, plasma-free process, employing anhydrous hydrogen fluoride (HF) vapor combined with ethanol to achieve isotropic etching, effectively releasing microstructures without the stiction and damage associated with traditional wet etching methods.
Etch Rate: Typically ranges from 0.1 to 10 µm/min Operating Pressure: Between 75 and 150 Torr. Operating Temperature: Approximately 45°C. Sample size: small piece to 100 mm.