SCVS Oxidation Furnace
Features
Key Features
- Ideal for R&D labs and pilot fabs
- Compact footprint – standalone configuration
- Low power consumption and easy maintenance
- Heating element: 1 temperature zone (upgradeable to 3 zones)
- Max temperature: up to 1300 °C
- Flat zone uniformity: ±0.5 °C
- Modular control system with independent hardware interlocks
- 4 gas lines
Atmospheric Processes
- Diffusion and drive-in at high temperature.
- Doping from solid sources is possible with a system upgrade.
- Suitable for annealing, curing, and sintering.
- Supports Pyrogenic Wet Oxide with External Burning System, Wet Oxide with ultrapure steamer, and Dry Oxide (High Pressure Oxide).
Technical Data
| Parameter | Specification |
|---|---|
| Sample size | 2″–4″ (50–100 mm) and pieces |
| Wafer load | Up to 5 wafers per batch |
| Heating zones | 1 (upgradeable to 3) |
| Flat zone | Up to 200 mm |
| Temperature range | 200 °C – 1300 °C |
| Uniformity | ±0.5 °C across flat zone |