Automatic Dicing Saw

The DISCO DAD322 is a precision dicing saw used to cut semiconductor wafers, glass, ceramics, and similar materials into smaller pieces, such as individual chips or devices.

wafer positioner machine with internal saw, water cooling and touchscreen panel

The system uses a high-speed rotating diamond blade to make clean, narrow cuts with high accuracy. The system supports automatic or manual alignment and controlled cutting depth, making it suitable for both straight and step-cut dicing.

Reservations & Training

Inventory ID:

ENG-N032

Manufacturer:

DISCO

Model:

DAD323

Year Installed:

2012

Category

Nanofab sample preparation

Section

Room Number:

Lab2-A647

Open to External Use?:

Consultation

Operation:

User/Staff Operated

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Features

Dicing up to 6" wafers (Silicon, Glass, Saphire...)
Spindle: up to 60.000rpm
Vacuum chuck
Camera based alignment (automatic or manual)
Different holding tape available

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